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Subjects
Digital, Electronic packaging, Electronics, Electronics, materials, Materials, Microelectronics, Permeability, Sealing (Technology), Sealing (technology), TECHNOLOGY & ENGINEERING, Dichtung, Elektronisches Bauelement, Gas dynamics, Hermetic sealing, Mathematical models, Matériaux, Mise sous boîtier (Électronique), Perméabilité, Électronique, ÉtanchéitéID Numbers
- OLID: OL25818A
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