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Jennie S. Hwang

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Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly

by Jennie S. Hwang First published in 1989 — 4 editions
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Modern solder technology for competitive electronics manufacturing

by Jennie S. Hwang First published in 1995 — 2 editions
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Implementing Lead-Free Electronics (McGraw-Hill Professional Engineering)

by Jennie S. Hwang First published in 2004 — 2 editions

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Lead-Free Solder Composition: United States Patent 9975207

by Jennie S. Hwang First published in 2020 — 1 edition

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Ball grid array & fine pitch peripheral interconnections: a handbook of the technology & applications for microelectronics/electronics manufacturing

by Jennie S. Hwang First published in 1995 — 1 edition

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Environment friendly electronics: lead-free technology

by Jennie S. Hwang First published in 2001 — 1 edition

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OLID: OL454514A

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