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John H. Lau

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Electronics manufacturing: with lead-free, halogen-free, and conductive-adhesive materials

by John H. Lau, C.P. Wong, Ning-Cheng Lee, and Ricky S.W. Lee First published in 2002 — 3 editions
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Semiconductor Advanced Packaging

by John H. Lau First published in 2021 — 3 editions

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Fan-Out Wafer-Level Packaging

by John H. Lau First published in 2018 — 3 editions

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Solder joint reliability: theory and applications

by John H. Lau First published in 1991 — 3 editions

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Electronic Packaging: Design, Materials, Process, and Reliability

by John H. Lau, C.P. Wong, and J.L. Prince First published in 1998 — 3 editions

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The Mechanics of solder alloy interconnects

by D. R. Frear, Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, and John H. Lau First published in 1993 — 2 editions

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Chip Scale Package: Design, Materials, Process, Reliability, and Applications

by John H. Lau, Ricky S.W. Lee, and Ricky S. Lee First published in 1999 — 2 editions

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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

by John H. Lau First published in 2000 — 2 editions

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Chiplet Design and Heterogeneous Integration Packaging

by John H. Lau First published in 2023 — 2 editions

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Heterogeneous Integrations

by John H. Lau First published in 2019 — 2 editions

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Assembly and Reliability of Lead-Free Solder Joints

by John H. Lau and Ning-Cheng Lee First published in 2020 — 2 editions

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Microvias: For Low Cost, High Density Interconnects

by John H. Lau and S.W. Ricky Lee First published in 2001 — 2 editions

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Solder Joint Reliability: Theory and applications

by John H. Lau First published in 1991 — 1 edition

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Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)

by John H. Lau First published in 1993 — 1 edition

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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

by John H. Lau First published in 1994 — 1 edition

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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

by John H. Lau First published in 1997 — 1 edition

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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

by John H. Lau First published in 2024 — 1 edition

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Thermal stress and strain in microelectronics packaging

by John H. Lau First published in 1993 — 1 edition

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Flip chip technologies

by John H. Lau First published in 1996 — 1 edition

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Ball grid array technology

by John H. Lau First published in 1995 — 1 edition
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OLID: OL537852A

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