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Richard C. Kullberg

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Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII: 28-29 January 2009, San Jose, California, United States

by Richard C. Kullberg, Rajeshuni Ramesham, SPIE, and Texas Instruments Incorporated Staff First published in 2009 — 1 edition

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Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX: 25-26 January 2010, San Francisco, California, United States

by Richard C. Kullberg and Rajeshuni Ramesham First published in 2010 — 1 edition

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OLID: OL7079302A

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