An edition of Proceedings, 1997 IEEE Multi-Chip Module Conference (1997)

Proceedings, 1997 IEEE Multi-Chip Module Conference

February 4-5, 1997, Santa Cruz, California

by , , and

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Cover of: Proceedings, 1997 IEEE Multi-Chip Module Conference by IEEE Multi-Chip Module Conference (1997 Santa Cruz, Calif.), IEEE Computer Society, Institute of Electrical and Electronics Engineers, IEEE Multi-Chip Module Conference (1997 Santa Cruz, Calif.)
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Last edited by Open Library Bot
April 13, 2010 | History
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An edition of Proceedings, 1997 IEEE Multi-Chip Module Conference (1997)

Proceedings, 1997 IEEE Multi-Chip Module Conference

February 4-5, 1997, Santa Cruz, California

by , , and

  • 1 Want to read

This edition doesn't have a description yet. Can you add one?

Publish Date
Publisher
IEEE Computer Society Press
Language
English
Pages
171

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Previews available in: English

Subjects

Congresses Multichip modules (Microelectronics) Neural networks (Computer science) CAD/CAM systems Thin films Optoelectronic devices Circuits & components Computer Hardware & Operating Systems Software engineering Digital Computer Hardware Integrated Circuits Computers Computers - General Information Science/Mathematics Computer Science Computer Engineering
Edition Availability
Cover of: 1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California
1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California : Proceedings
February 1997, Ieee Computer Society
Hardcover in English
Cover of: 1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California
1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California : Proceedings
February 1997, Institute of Electrical & Electronics Enginee
Paperback in English
Cover of: Proceedings, 1997 IEEE Multi-Chip Module Conference
Proceedings, 1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California
1997, IEEE Computer Society Press
in English
Cover of: Proceedings, 1997 IEEE Multi-Chip Module Conference
Proceedings, 1997 IEEE Multi-Chip Module Conference: February 4-5, 1997, Santa Cruz, California
1997, IEEE Computer Society Press
in English

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Book Details

Table of Contents

Session 1. Flip-chip I
Session II. Mixed signal MCMs
Session III. MCM design and CAD
Session IV: Panel: The best road to integration? Single chip or multi-chip?
Session V: Interconnect analysis and simulation
Session VI. Flip-chip II
Session VII. Test, technology and infrastructure
Session VIII: Optical MCMs
Session IX: Wrap up panel
Author index.

Edition Notes

"IEEE catalog number 97CB36039"--T.p. verso.

Includes bibliographical references and author index.

Published in
Los Alamitos, Calif
Genre
Congresses.
Other Titles
1997 IEEE Multi-Chip Module Conference., IEEE Multi-Chip Module Conference.

The Physical Object

Pagination
x, 171 p. :
Number of pages
171

Edition Identifiers

Open Library
OL19900157M
ISBN 10
0818677899, 0780339037
LCCN
96079698
OCLC/WorldCat
36524697

Work Identifiers

Work ID
OL12925144W

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